PCB Manufacturing
Advanced PCB manufacturing capabilities, specializing in high-precision, high-difficulty, and special materials, serving industries such as scientific research, RF, military, medical, robotics, and AI.
What is PCB(Printed Circuit Board) Manufacturing?
PCB Manufacturing (Printed Circuit Board Manufacturing) refers to the process of converting circuit designs into actually usable circuit boards.
Printed Circuit Board Manufacturing
Design and Output
Design circuit diagrams and layouts using EDA software such as Altium and KiCad, and generate Gerber files (containing graphic information of each layer).
Substrate preparation
Select copper clad laminates (such as FR-4), clean them and cut them to the required size.
Graphic transfer
Lithography: Photoresist is applied to the copper-clad laminate, and the design pattern is transferred onto the laminate through ultraviolet light exposure. Etching: Remove unprotected copper with chemical solutions (such as ferric chloride) to form circuit traces.
Drilling
Holes are drilled with mechanical or laser drilling machines for installing components or interconnecting layers.
Copper plating and surface treatment
Electrical connection is achieved by depositing copper on the hole wall through electroplating. Surface treatment (such as tin spraying, gold plating, OSP) prevents oxidation and enhances solderability.
Screen printing and solder mask
Apply a solder mask layer (usually green) to insulate and protect the traces, and silk-screen the component identification.
Testing and Inspection
Conduct electrical tests (such as flying probe tests) and visual inspections to ensure there are no defects such as short circuits or open circuits.
Forming and packaging
Cut into the final shape and package for shipment.
Key technologies and types
Technical classification
*Single-sided panel: Only one side has circuits.
*Double-sided panel: Two sides of the circuit are connected through vias.
*Multi-layer boards (4-100+ layers) : used for complex devices (such as mobile phones, servers).
Advanced technology
*HDI board: High-density interconnections, tiny vias and fine circuits.
*Flexible board: Bendable and used in wearable devices, etc.
*Metal substrate: Strong heat dissipation, used in leds and power supplies.
Application field
Consumer electronics
Communication equipment
Automotive electronics
Medical equipment, aerospace, etc.
Trends and Challenges
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Miniaturization
Thinner line width, smaller hole diameter.
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Environmental protection requirements
lead-free process, waste treatment.
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Automation and Intelligence
AI quality inspection, intelligent manufacturing systems.
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PCB manufacturing
PCB manufacturing integrates materials science, precision mechanics and chemical processes...